| 微连接焊点热循环可靠性的研究进展 |
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| 引用本文： | 李聪,陈继兵,安兵,吴懿平. 微连接焊点热循环可靠性的研究进展[J]. 电子工艺技术, 2011, 32(6): 316-320,329 |
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| 作者姓名： | 李聪 陈继兵 安兵 吴懿平 |
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| 作者单位： | 武汉光电国家实验室,湖北武汉,430074 |
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| 基金项目： | 国家自然科学基金项目(项目编号:60876070) |
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| 摘 要： | 介绍了国内外关于微连接焊点热循环可靠性的研究进展。热循环的作用会使焊点内部组织粗化、IMC长大和变厚和锡基无铅焊料重结晶等,诱发焊点中裂纹的萌生与扩展。主流观点认为,焊点的失效是一种疲劳与蠕变相结合的机制。分析了对未来无机械应力作用的单一焊点样品进行热循环实验的意义。影响焊点热循环寿命的因素有焊料成分、焊盘UBM层、焊...
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| 关 键 词： | 热循环 微观组织 失效机制 寿命预测 预测模型 |
Review on Reliability of Micro-Solder Joints Subjected to Thermal Cycling |
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| LI Cong,,CHEN Ji-bing,AN Bing,WU Yi-ping. Review on Reliability of Micro-Solder Joints Subjected to Thermal Cycling[J]. Electronics Process Technology, 2011, 32(6): 316-320,329 |
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| Authors: | LI Cong CHEN Ji-bing AN Bing WU Yi-ping |
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| Affiliation: | LI Cong1,2,CHEN Ji-bing1,AN Bing1,WU Yi-ping1,2(1.Wuhan National Laboratory for Optoelectronics,Wuhan 430074,China 2.Huazhong University of Science and Technology,China) |
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| Abstract: | A review on reliability of micro-solder joints subjected to thermal cycling is presented.The effects of thermal cycling on the microstructure of solder joints include coarsening behavior,inter-metallic growth and re-crystallization behavior of lead free solder joints.Consequently it can harm the mechanical performance of solder joints as well as cause the initiation and propagation of cracks among them,which eventually lead to the breakup of components.Based on the review,point out that future work focus on... |
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| Keywords: | thermal cycling microstructure life time prediction fatigue models |
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