| Cu镀Au腔体气密性封装工艺研究 |
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| 引用本文： | 刘远志,卢肖.Cu镀Au腔体气密性封装工艺研究[J].电子工艺技术,2011,32(5):297-299,302. |
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| 作者姓名： | 刘远志 卢肖 |
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| 作者单位： | 中国电子科技集团第二十九研究所,四川成都,610036 |
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| 摘 要： | Cu镀Au腔体是微波器件常用封装载体之一。在目前应用中,Cu镀Au腔体微波器件的气密性封装一直是工程化技术难题,大幅影响了微波器件的可靠性和使用寿命。对基于Cu镀Au腔体的微波器件进行了气密性封装研究,探讨了Cu镀Au腔体实现气密性封装可能的工艺路线。通过比较激光封焊和真空钎焊等传统气密性封装工艺方法,提出了＂小孔密封...
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| 关 键 词： | 封装工艺 Cu镀Au腔体 激光封焊 真空钎焊 |
Technology of Gold-Plated Cupreous Shell Encapsulation |
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| LIU Yuan-zhi,LU Xiao.Technology of Gold-Plated Cupreous Shell Encapsulation[J].Electronics Process Technology,2011,32(5):297-299,302. |
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| Authors: | LIU Yuan-zhi LU Xiao |
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| Affiliation: | LIU Yuan-zhi,LU Xiao(CETC No.29 Research Institute,Chengdu 610036,China) |
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| Abstract: | Gold-plated cupreous shell is one of the most common packaging techniques for microwave devices.Now the encapsulation of gold-plated cupreous shell has become the bottleneck of industrial engineering,and greatly limits the reliability and useful life of microwave devices.The encapsulation technology of gold-plated cupreous shell which is widely used for digital control attenuator is researched.The possible processing approaches have been compared with each other.After the comparison between laser welding an... |
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| Keywords: | Encapsulation technology Gold-plated cupreous shell Laser welding Vacuum soldering |
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