|
|||||
|
|
| 电子封装与组装焊点界面反应及微观组织研究进展 | |
| 引用本文： | 安荣,刘威,杭春进,田艳红,王春青,安茂忠. 电子封装与组装焊点界面反应及微观组织研究进展[J]. 电子工艺技术, 2011, 32(6): 321-325,329 |
| 作者姓名： | 安荣 刘威 杭春进 田艳红 王春青 安茂忠 |
| 作者单位： | 1. 哈尔滨工业大学化工学院,黑龙江哈尔滨,150001 2. 哈尔滨工业大学机电工程学院,黑龙江哈尔滨,150001 3. 哈尔滨工业大学先进焊接与连接国家重点实验室,黑龙江哈尔滨,150001 |
| 基金项目： | 国家自然科学基金资助项目(项目编号:51005055) |
| 摘 要： | 软钎焊焊点界面反应是连接金属的最古老的冶金工艺过程。随着倒装芯片(FC)、球栅阵列(BGA)和芯片级封装(CSP)等面封装技术的兴起,近年来Sn基钎料被广泛应用于微电子制造,包括芯片和基板之间的封装互连以及基板与印制电路板之间的组装互连。这就需要系统地研究Sn基钎料焊点界面反应及微观组织。从形态学、热力学和动力学的角度回顾总结了SnPb共晶钎料、高Pb钎料和无Pb钎料与Cu、Ni、Au/Ni/Cu、PdAg焊盘之间的界面反应。 |
| 关 键 词： | 界面反应 微观组织 Sn基钎料 金属间化合物 |
Sn-based Solder Reaction and Microstructure in Electronic Packaging and Assembly |
|
| AN Rong,,,LIU Wei,HANG Chun-jin,,TIAN Yan-hong,WANG Chun-qing,AN Mao-zhong(.School of Chemical Engineering , Technology,Harbin Institute of Technology,Harbin ,China,.Key Laboratory of Micro-systems , Micro-structures Manufacturing,Ministry of Education,.School of Mechatronics Engineering,.State Key Laboratory of Advanced Welding , Joining,Harbin .... Sn-based Solder Reaction and Microstructure in Electronic Packaging and Assembly[J]. Electronics Process Technology, 2011, 32(6): 321-325,329 | |
| Authors: | AN Rong LIU Wei HANG Chun-jin TIAN Yan-hong WANG Chun-qing AN Mao-zhong(.School of Chemical Engineering & Technology Harbin Institute of Technology Harbin China .Key Laboratory of Micro-systems Micro-structures Manufacturing Ministry of Education .School of Mechatronics Engineering .State Key Laboratory of Advanced Welding Joining Harbin ... |
| Affiliation: | AN Rong1,2,4,LIU Wei3,HANG Chun-jin1,3,TIAN Yan-hong4,WANG Chun-qing4,AN Mao-zhong1(1.School of Chemical Engineering & Technology,Harbin Institute of Technology,Harbin 150001,China,2.Key Laboratory of Micro-systems and Micro-structures Manufacturing,Ministry of Education,3.School of Mechatronics Engineering,4.State Key Laboratory of Advanced Welding and Joining,Harbin 150001... |
| Abstract: | Solder reaction is one of the oldest metallurgical processes for joining metal parts.With the development of surface packaging technology,such as FC,BGA,and CSP,the use of solder in modern microelectronic technology,that is in connecting the lead frame of a chip to a substrate and in joining the substrate to a print circuit board,is ubiquitous.For the success of the technology,it requires a systematic study of solder reaction.Reviewed solder reactions between one of the several types of Sn-based solders and... |
| Keywords: | Solder reaction Microstructure Sn-based solder Intermetallic compounds |
| 本文献已被 CNKI 万方数据 等数据库收录！ | |