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Fe基体上Ni膜和Cu基体上Ag膜的膜内应力
引用本文:王姗姗,祝要民,任凤章,赵士阳,田保红. Fe基体上Ni膜和Cu基体上Ag膜的膜内应力[J]. 材料科学与工程学报, 2011, 0(3): 429-432
作者姓名:王姗姗  祝要民  任凤章  赵士阳  田保红
作者单位:河南科技大学材料科学与工程学院;河南省有色金属材料科学与加工技术重点实验室;
基金项目:国家自然科学基金资助项目(50771042); 河南省基础与前沿技术研究计划资助项目(092300410064); 河南省科技创新人才计划资助项目(104100510005); 河南省高校科技创新人才支持计划资助项目(2009HASTIT023)
摘    要:直流电沉积法在Fe基体上制备Ni膜和在Cu基体上制备Ag膜,利用悬臂梁法在线测量了膜中的平均应力,并计算了膜内分布应力,且对膜内平均应力的实验结果与Thomas?Feimi?Dirac?Cheng(TFDC)电子模型理论估算结果进行了对比。结果表明,Fe基体上Ni膜的平均应力和分布应力均为拉应力,而Cu基体上Ag膜的平均应力和分布应力均为压应力。两种膜的内应力均由界面应力引起。对于相同的基体和镀膜,膜内平均内应力的理论估算值与实验值较接近。

关 键 词:薄膜  内应力  悬臂梁法  电子理论

Internal Stresses in Ni film on Fe Substrate and Ag film on Cu Substrate
WANG Shan-shan,ZHU Yao-min,REN Feng-zhang,ZHAO Shi-yang,TIAN Bao-hong. Internal Stresses in Ni film on Fe Substrate and Ag film on Cu Substrate[J]. Journal of Materials Science and Engineering, 2011, 0(3): 429-432
Authors:WANG Shan-shan  ZHU Yao-min  REN Feng-zhang  ZHAO Shi-yang  TIAN Bao-hong
Affiliation:WANG Shan-shan1,ZHU Yao-min1,REN Feng-zhang1,2,ZHAO Shi-yang2,TIAN Bao-hong1(1.School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471003,China,2.Henan Key Laboratory of Advanced Non-ferrous Metals,China)
Abstract:Ni film on Fe substrate and Ag film on Cu substrate are prepared by electroplating method.The cantilever beam method is used to measure average internal stresses of the films in situ.Distributed internal stresses in Ni and Ag films are calculated.Theoretical internal stresses are calculated using Thomas–Feimi–Dirac–Cheng(TFDC) electron theory model,which are compared with experimental results.The results show that average and distributed internal stresses in Ni films on Fe substrates are tensile stresses,while average and distributed internal stresses in Ag films on Cu substrates are pressure stresses.These internal stresses are caused by interfacial stresses.The experimental internal stresses are close to theoretical results.
Keywords:films  internal stress  cantilever beam method  electron theory  
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