Toughening of AT-Resins with a Polyphenylquinoxaline |
| |
Authors: | Yesh P Sachdeva Stanley E Wentworth |
| |
Affiliation: |
a Dexter Adhesives & Structural Materials Division, Hysol Aerospace Products, The Dexter Corporation, Pittsburg, CA, U.S.A.
b U.S. Army Materials Technology Laboratory, Watertown, Massachusetts, U.S.A. |
| |
Abstract: | Acetylene terminated (AT) resins are addition-curable thermoset materials which do not generate volatiles during cure and therefore can be fabricated into void-free structures. They retain good thermal and mechanical properties even after exposure to high humidity environments. Their use as composite matrix resins and adhesives has shown promise. These resins, however, are brittle. Molecular structure modifications and blending with thermoplastic modifiers have been used to improve their toughness. In this work, improvement in toughness has been sought through the use of a polyphenylquinoxaline (PPQ) modifier. The blended systems showed improvements in toughness, thermooxidative stability, and lap shear strength over the original AT-resins. |
| |
Keywords: | Acetylene terminated (AT) resins toughened AT-resins AT-resins based on benzophenone and diphenyl sulfone polyphenylquinoxaline (PPQ) as a toughener blends of AT-resins with PPQ adhesive properties of AT-resins |
本文献已被 InformaWorld 等数据库收录! |
|