Modification of polymer properties to minimize thermal stresses in adhesive joints |
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| Authors: | A M Zihlif L Feldman R J Farris |
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| Affiliation: | (1) Physics Department, University of Jordan, Amman, Jordan;(2) Polymer Science and Engineering Department, University of Massachusetts, 01003 MA, Amherst, USA |
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| Abstract: | The adhesive behaviour of epoxy-glass microballoon composites was studied at 25 and 75° C for plate and tubular lap joints of various combinations. It was found that the adhesive bond for various joints is enhanced through addition of microballoons. High adhesive force is observed at higher temperatures for various joints combinations where the thermal stresses are lowered and the bond is strengthened. The obtained results for various joint combinations demonstrate that high strength can be achieved when significant thermal stresses do not exist. The filler effect on some physical properties such as density, glass transition temperature, thermal expansion and Poisson's ratio of the epoxy composites is also investigated. Simple analysis indicates the differential thermal expansion coefficient between the adhesive and metallic joints and bulk modulus of the adhesive dictates the stress state. |
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