Microstructure evolution of single crystal copper wires in cold drawing |
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| Authors: | Chen Jian Yan Wen Wang XueYan Fan XinHui |
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| Affiliation: | 1. Department of Applied Physics, Northwestern Polytechnical University, Xi'an 710072, China;School of Material Science and Chemical Engineering, Xi'an Technological University, Xi'an 710032, China
2. School of Material Science and Chemical Engineering, Xi'an Technological University, Xi'an 710032, China |
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| Abstract: | The deformation microstructure evolution of single crystal copper wires produced by OCC method has been studied with the help
of TEM, EBSD and OM. The results show that there are a small number of dendrites and twins in the undeformed single crystal
copper wires. However, it is difficult to observe these dendrites in deformed single crystal copper wires. The structure evolution
of deformed single crystal copper wires during drawing process can be divided into three stages. When the true strain is lower
than 0.94, macroscopic subdivision of grains is not evident, and the microscopic evolution of deformed structure is that the
cells are formed and elongated in drawn direction. When the true strain is between 0.94 and 1.96, macroscopic subdivision
of grains takes place, and the number of microbands located on {111} and cell blocks is much more than that with the true
strain lower than 0.94. When the true strain is larger than 1.96, the macroscopic subdivision of grains becomes more evident
than that with the true strain between 0.94 and 1.96, and S-bands structure and lamellar boundaries will be formed. From EBSD
analysis, it is found that part of 〈100〉 texture resulting from solidifying is transformed into 〈111〉 and 〈112〉 due to shear
deformation, but 〈100〉 texture component is still kept in majority. When the true strain is 0.94, the misorientation angle
of dislocation boundaries resulting from deformation is lower than 14°. However, when the true strain arrives at 1.96, the
misorientation angle of some boundaries will be greater than 50°, and the peak of misorientation angle distribution produced
by texture evolution is located in the range between 25° and 30°.
Supported by the National Natural Science Foundation of China (Grant Nos. 50471098 and 59971033), the Natural Science Foundation
of Shaanxi Province, China (Grant No. 2003E101), and the Teaching and Research Award Program for Outstanding Young Teachers
in Higher Education Institution of MOE, China |
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| Keywords: | single crystal copper wires deformation structure electron backscattering diffraction transmission electron microscopy |
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