| 金刚石线锯切割单晶硅表面缺陷与锯丝磨损分析 |
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| 引用本文： | 黄波,高玉飞,葛培琪.金刚石线锯切割单晶硅表面缺陷与锯丝磨损分析[J].金刚石与磨料磨具工程,2011,31(1):53-57. |
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| 作者姓名： | 黄波 高玉飞 葛培琪 |
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| 作者单位： | 山东大学机械工程学院,济南,250061;高效洁净机械制造教育部重点实验室,济南,250061 |
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| 基金项目： | 济南市科技计划资助项目 |
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| 摘 要： | 采用电镀金刚石线锯对单晶硅进行了锯切实验,使用扫描电子显微镜对单晶硅锯切的表面缺陷与锯丝失效机理进行了研究,分析了走丝速度和工件进给速度对锯切单晶硅表面缺陷特征的影响.分析发现:线锯锯切的硅片表面缺陷主要有较长较深的沟槽、较浅的断续划痕、材料脆性去除留下的表面破碎及个别较大较深的凹坑.走丝速度增大,工件进给速度降低,锯...
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| 关 键 词： | 金刚石线锯 单晶硅 表面缺陷 磨损 |
Study on surface defect and wire wear mechanism during single crystal silicon slicing with electroplated diamond wire saw |
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| Huang Bo,Gao Yufei,Ge Peiqi.Study on surface defect and wire wear mechanism during single crystal silicon slicing with electroplated diamond wire saw[J].Diamond & Abrasives Engineering,2011,31(1):53-57. |
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| Authors: | Huang Bo Gao Yufei Ge Peiqi |
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| Affiliation: | Huang Bo1,2 Gao Yufei1,2 Ge Peiqi1,2(1.School of Mechanical Engineering,Shandong University,Jinan 250061,China)(2.Key Laboratory of High Efficiency and Clean Mechanical Manufacture(Shangdong Universitg),Ministry of Education,China) |
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| Abstract: | Based on the experiments of slicing single crystal silicon with electroplated diamond wire saw,the surface defects of sawed silicon crystal and wire failure mechanism were analyzed using the scanning electron microscope(SEM).The influences of wire speed and workpiece feed speed on surface defect features were discussed.The analysis results show that the surface defects include some obvious grooves,intermittent scratch marks,brittle fracture or brittle crash,and some relatively larger and deeper pits.When wi... |
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| Keywords: | diamond wire saw single crystal silicon surface defect wear |
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