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软包装无溶剂复合技术研究进展
引用本文:郭鹏飞,付亚波,何昊葳,左津津,赵有中,许文才. 软包装无溶剂复合技术研究进展[J]. 包装工程, 2018, 39(9): 44-50
作者姓名:郭鹏飞  付亚波  何昊葳  左津津  赵有中  许文才
作者单位:北京印刷学院北京市印刷包装材料与技术重点实验室,北京,102600;广州通泽机械有限公司,广州,510830;上海康达化工新材料股份有限公司,上海,201419
基金项目:国家重点研发计划(2016YFC0204200);北京市协同创新项目(04190117019)
摘    要:目的综述软包装无溶剂复合技术在复合设备、胶黏剂和复合工艺等方面的研究进展。方法通过无溶剂复合技术与干式复合技术的对比,阐述无溶剂复合在工艺流程、复合参数、适用范围和经济效益等方面的特点及优势。介绍目前部分企业的无溶剂复合设备和胶黏剂的发展现状及其国内外科研方面的研究进展。最后分析当前无溶剂复合技术所面临的问题及挑战,并提出未来的发展趋势。结果无溶剂复合技术与干式复合技术相比,不仅在产能方面具有明显的优势,同时又存在巨大的经济效益与环保特性。结论无溶剂复合工艺因其突出的优势,符合当前环保的要求,是今后软包装复合主要的研究发展方向。

关 键 词:软包装  无溶剂复合  干式复合  聚氨酯  胶黏剂
收稿时间:2017-11-03
修稿时间:2018-05-10

Research Progress of Solvent-free Laminating Technology of Flexible Package
GUO Peng-fei,FU Ya-bo,HE Hao-wei,ZUO Jin-jin,ZHAO You-zhong and XU Wen-cai. Research Progress of Solvent-free Laminating Technology of Flexible Package[J]. Packaging Engineering, 2018, 39(9): 44-50
Authors:GUO Peng-fei  FU Ya-bo  HE Hao-wei  ZUO Jin-jin  ZHAO You-zhong  XU Wen-cai
Affiliation:Beijing Key Lab of Printing & Packaging Materials and Technology, Beijing Institute of Graphic Communication, Beijing 102600, China,Beijing Key Lab of Printing & Packaging Materials and Technology, Beijing Institute of Graphic Communication, Beijing 102600, China,Beijing Key Lab of Printing & Packaging Materials and Technology, Beijing Institute of Graphic Communication, Beijing 102600, China,Guangzhou Sinomech Corporation, Guangzhou 510830, China,Shanghai KangDa New Materials Co., Ltd., Shanghai 201419, China and Beijing Key Lab of Printing & Packaging Materials and Technology, Beijing Institute of Graphic Communication, Beijing 102600, China
Abstract:The work aims to summarize the research progress of solvent-free laminating technology of flexible package in respect of laminating equipment, adhesives and laminating technology. The characteristics and advantages of solvent-free laminating in the technological process, laminating parameters, application scope and economic benefit were expounded upon the comparison of solvent-free laminating technology and dry laminating technology. The current development status of solvent-free laminating equipment and adhesive of part of enterprises, and the research progress at home and abroad were introduced. Finally, the problems and challenges faced by the current solvent-free laminating technology were analyzed, and the development trend was proposed. The solvent-free laminating technology had not only obvious advantages in terms of productivity, but also huge economic benefit and environmental protection feature compared with the dry laminating technology. Solvent-free laminating technology is the main research and development direction of flexible package in the future because of its outstanding advantages and compliance with the current requirements of environmental protection.
Keywords:flexible package   solvent-free laminating   dry laminating   polyurethane   adhesive
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