芯片基板材料的液浸法超声测量研究

采用基于脉冲反射法、A型显示法、纵波法、单探头法以及液浸法的超声测量方式对组成芯片的铝基板和铜基板声速进行测量。分别采用基于换能器移动改变声程和基于反射底面变化改变声程2种方法,对水的声速进行标定测量,得到系统的测量误差为0.13%;基于反射界面变化改变声程测量铝基板和铜基板,在90%的置信概率区间内,得到铝基板的声速为(6375.97±29.97)m/s、铜基板的声速为(4655.70±28.24)m/s;对铝基板和铜基板的仿真分析与测量结果相似,表明该测量方式具有较高精度。测得的声速可用于研究芯片的其他物理特性以及超声检测芯片的连接及内部界面结合质量。

Immersion Ultrasonic Testing for Chips Substrate Materials

By using the methods based on pulse echo method, A-scan method, longitudinal wave method, single probe method and immersion method, the longitudinal sound velocities of aluminum and copper chip substrate were measured. The two methods of changing the sound path based on transducer movement and based on reflecting undersurface change were respectively used to calibrate the sound velocity in water, and the measurement error of the system was 0.13%. Adopting the method of changing the sound path based on reflection interface change, the sound velocities of aluminum substrate and copper substrate were measured. Within the 90% confidence probability interval, the sound velocity of aluminum and copper substrate are (6 375.97±29.97)m/s and (4 655.70±28.24)m/s respectively. The simulation results are similar to the measurement results, which shows that the measurement method has high accuracy. The measured sound velocity can be used to study other physical characteristics of the chip as well as the bonding quality of the connection and internal interface of the chips.