The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys—the effect of Ag |
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| Authors: | Kang-I Chen Kwang-Lung Lin |
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| Affiliation: | (1) Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan 70101, Republic of China |
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| Abstract: | The microstructures and mechanical properties of Sn-8.55Zn-xAg-0.45 Al-0.5Ga (wt.%) lead-free solders were investigated. The
x content of the solders investigated were 0.5–3.0 wt.%. The results indicate that Ag plays an important role not only in
the structure but also in the mechanically properties. The mechanical properties and differential scanning calorimetry (DSC)
behavior has been compared with that of 63Sn-37Pb solder. Small additions of Ag decreased the melting point of the Sn-8.55Zn-xAg-0.45Al-0.5Ga
solders while maintaining the same strength and ductility as the 63Sn-37Pb solder. |
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| Keywords: | Lead-free solder Sn-Zn Sn-Zn-Ag mechanical properties DSC |
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