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High‐temperature thin‐film barriers for foldable AMOLED displays |
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| Authors: | Hylke B Akkerman Raghu K Pendyala Pradeep Panditha Ahmed Salem Jie Shen Peter van de Weijer Piet CP Bouten Suzanne HPM de Winter Karin van Diesen‐Tempelaars Gerard de Haas Soeren Steudel Ching‐Yu Huang Ming‐Hsiang Lai Yen‐Yu Huang Ming‐Hua Yeh Auke Jisk Kronemeijer Paul Poodt Gerwin H Gelinck |
| Affiliation: | 1. TNO/Holst Centre, Eindhoven, The Netherlands;2. IMEC, Leuven, Belgium;3. Chunghwa Picture Tubes, Ltd., Bade City, Taoyuan, Taiwan |
| Abstract: | We present a thin‐film dual‐layer bottom barrier on polyimide that is compatible with 350°C backplane processing for organic light‐emitting diode displays and that can facilitate foldable active‐matrix organic light‐emitting diode devices with a bending radius of <2 mm. We demonstrate organic light‐emitting diodes that survive bending over 0.5 mm radius for 10.000× based on the high‐temperature bottom barrier. Furthermore, we show compatibility of the bottom barrier with the backplane process by fabricating active‐matrix organic light‐emitting diode displays on GEN1‐sized substrates. |
| Keywords: | high temperature thin‐film barrier foldable AMOLED displays |