|
|||||
|
|
| 安装技术的现状和将来展望 | |
| 引用本文： | 蔡积庆. 安装技术的现状和将来展望[J]. 印制电路信息, 2008, 0(9): 64-69 |
| 作者姓名： | 蔡积庆 |
| 作者单位： | 江苏南京,210018 |
| 摘 要： | 概述了安装技术的现状、课题和将来的密度提高和低温焊料连接。 |
| 关 键 词： | 安装技术 现状 密度提高 低温焊料连接 印制板 半导体芯片 |
Current Status and Future Development of Mounting Technology |
|
| CAI Ji-qing. Current Status and Future Development of Mounting Technology[J]. Printed Circuit Information, 2008, 0(9): 64-69 | |
| Authors: | CAI Ji-qing |
| Affiliation: | CAI Ji-qing |
| Abstract: | This paper describes the current status and theme of mounting technology and density rise and low temperature solder connection in the future. |
| Keywords: | mounting technology current status density rise low temperature solder connection printed circuit board semicoudutor chip |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |