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Flexible Electronics: Biodegradable Electronic Systems in 3D,Heterogeneously Integrated Formats (Adv. Mater. 11/2018)
Authors:Jan‐Kai Chang  Hui‐Ping Chang  Qinglei Guo  Jahyun Koo  Chih‐I Wu  John A. Rogers
Affiliation:1. Center for Bio‐Integrated Electronics, Northwestern University, Evanston, IL, USA;2. Institute of Photonics and Optoelectronics, National Taiwan University, Taipei, Taiwan;3. Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana‐Champaign, Urbana, IL, USA;4. Department of Materials Science, Fudan University, Shanghai, P. R. China;5. Department of Materials Science and Engineering, Department of Biomedical Engineering, Department of Neurological Surgery, Department of Chemistry, Department of Mechanical Engineering, Department of Electrical Engineering, and Department of Computer Science, Simpson Querrey Institute, Feinberg Medical School, Northwestern University, Evanston, IL, USA
Abstract:
Keywords:3D integration  biodegradable electronics  flexible devices  heterogeneous integration  transfer printing
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