| SiCp/Cu复合材料切削加工性及其加工表面微观结构研究 |
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| 引用本文： | 戈晓岚,姜左,许晓静,蔡兰,陶亦亦.SiCp/Cu复合材料切削加工性及其加工表面微观结构研究[J].中国机械工程,2006,17(9):965-968. |
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| 作者姓名： | 戈晓岚 姜左 许晓静 蔡兰 陶亦亦 |
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| 作者单位： | 1. 江苏大学,镇江,212013
2. 苏州职业大学,苏州,215011 |
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| 摘 要： | 通过应变测力仪，测量每一组切削用量参数下Cu及SiCp／Cu复合材料的切削力，并用电子显微镜观察分析切削表面的微观结构。研究表明：由于SiC颗粒对位错运动的阻碍，在SiCp／Cu界面处形成位错塞集群，产生应力集中，使SiCp／Cu复合材料切削过程呈典型的脆性分离；切削力随背吃刀量和进给量的增大而增大，随切削速度的增大而减小。
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| 关 键 词： | 颗粒 复合材料 切削力 微观结构 位错 |
| 文章编号： | 1004-132X（2006）09-0965-04 |
| 收稿时间： | 2005-04-29 |
| 修稿时间： | 2005-04-29 |
Research on the SiCp/Cu Composite Material's Cutting Performance and Machined Surface Texture |
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| Ge Xiaolan,Jiang Zuo,Xu Xiaojing,Cai Lan,Tao Yiyi.Research on the SiCp/Cu Composite Material''''s Cutting Performance and Machined Surface Texture[J].China Mechanical Engineering,2006,17(9):965-968. |
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| Authors: | Ge Xiaolan Jiang Zuo Xu Xiaojing Cai Lan Tao Yiyi |
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| Affiliation: | 1. Jiangsu University, Zhenjiang, Jiangsu, 212013 ; 2. Suzhou Vocational University,Suzhou, Jiangsu, 215011 |
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| Abstract: | We measured the cutting forces of Cu and SiCp/ Cu composite material corresponding to every group of cutting parameters by straingauge and survey the cutting surface and the sub-surface's micro-structure by scanning electric microscope.This research has shown: because the SiCp particles prevent the dislocation moving,the dislocation groups are formed on the SiCp/Cu interface,and the stress concentration is produced,the typical brittle separation appears in the SiCp/Cu composite material cutting process.In addition,the cutting force increases with the depth of cut and feed increasing and decreases while the cutting speed increases. |
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| Keywords: | particle composite material cutting force micro-structure dislocation |
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