| 基于正交设计的QFN焊点三维形态建模与预测 |
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| 引用本文： | 廖勇波,周德俭,黄春跃,吴兆华.基于正交设计的QFN焊点三维形态建模与预测[J].桂林工学院学报,2007,27(2):274-277. |
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| 作者姓名： | 廖勇波 周德俭 黄春跃 吴兆华 |
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| 作者单位： | 1. 桂林电子科技大学,机电工程系,广西,桂林,541004
2. 桂林电子科技大学,机电工程系,广西,桂林,541004;桂林工学院,电子与计算机系,广西,桂林,541004 |
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| 基金项目： | 广西自然科学基金资助项目（02336060） |
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| 摘 要： | 采用基于最小能量原理和有限元数值分析方法的Surface Evolver软件,建立了四方扁平无引脚器件(QFN)焊点三维形态预测模型;选取焊盘长度、焊盘宽度、焊料体积、间隙高度作为4个关键因素,采用水平正交表设计了9种不同的QFN焊点工艺参数水平组合,建立了这9种焊点的三维形态预测模型,得到了不同工艺参数水平组合下的QFN焊点形态;焊盘长度、焊盘宽度、焊料体积、间隙高度等工艺参数的改变对QFN焊点的三维形态均有影响.
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| 关 键 词： | 四方扁平无引脚器件(QFN) 焊点形态 最小能量原理 正交设计 |
| 文章编号： | 1006-544X（2007）02-0274-04 |
| 修稿时间： | 2006-03-28 |
Modeling and 3-D Solder Joint Shape Predicting of QFN Based on Orthogonal Designs |
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| LIAO Yong-bo,ZHOU De-jian,HUANG Chun-yue,WU Zhao-hua.Modeling and 3-D Solder Joint Shape Predicting of QFN Based on Orthogonal Designs[J].Journal of Guilin University of Technology,2007,27(2):274-277. |
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| Authors: | LIAO Yong-bo ZHOU De-jian HUANG Chun-yue WU Zhao-hua |
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| Affiliation: | 1. School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology 541004, China;2. Department of Electronics and Computer Science, Guilin University of Technology, Guilin 541004, China |
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| Abstract: | 3-D(Three-dimensional) predicting model of QFN solder joint shape is built by Surface Evolver software based on minimal energy principle and finite mathematical analysis method.The length of pad,width of pad,volume of solder and height of clearance are chosen as key factors.Nine kinds of process level combinations of QFN solder joint are designed through orthogonal array.3-D predicting models of the nine kinds of solder joints are built and the QFN solder joint shapes under different process level combination are achieved.The effects on length of pad,width of pad,volume of solder and height of clearance on the QFN solder joint shape are analyzed.The results of analyzing the 3-D shape of QFN solder joint show that the length of pad,width of pad and the volume of solder and height of clearance have a remarkable effect on the 3-D shape of QFN solder joint. |
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| Keywords: | quad flat no-lead(QFN) solder joint shape the minimal energy principle the orthogonal designs |
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