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Encapsulation of organic light-emitting devices by means of photopolymerized polyacrylate films
Authors:Gi Heon Kim  Jiyoung Oh  Yong Suk Yang  Lee-Mi Do  Kyung Soo Suh
Affiliation:Basic Research Laboratory, Electronics and Telecommunications Research Institute, 161 Gajeong-Dong, Yuseong-Gu, Daejeon 305-350, South Korea
Abstract:For encapsulation of organic light-emitting devices (OLEDs) built on glass substrate, photopolymerizable blend consists of pentaerythritol triacrylate (PETIA) and HSP188 (photoinitiator) was spin-coated onto an OLED and then cured to form a cross-linked passivation layer. The electroluminescence (EL) and the rate of degradation were examined to compare the electrical and the emissive properties of the device before and after forming the passivation layer. In this case, wet process encapsulation, which did not influence the EL characteristic of the device, enhanced the lifetime of the device in air.
Keywords:Photopolymerization  Passivation  Organic light-emitting devices
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