| 印制板和安装基板的外观检查技术 |
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| 引用本文： | 蔡积庆. 印制板和安装基板的外观检查技术[J]. 印制电路信息, 2008, 10(3): 53-57 |
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| 作者姓名： | 蔡积庆 |
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| 作者单位： | 江苏南京210018 |
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| 摘 要： | 概述了印制板和安装基板的外观检查技术的现状和动向。
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| 关 键 词： | 印制板 安装基板 外观检查技术 |
| 文章编号： | 1009-0096(2008)03-0053-05 |
Visual Inspection Technology of Printed Circuit Board and Mounting Substrate |
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| CAI Ji-qing. Visual Inspection Technology of Printed Circuit Board and Mounting Substrate[J]. Printed Circuit Information, 2008, 10(3): 53-57 |
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| Authors: | CAI Ji-qing |
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| Affiliation: | CAI Ji-qing |
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| Abstract: | This paper describes the current state and trend of external inspection technology of printed circuit board and mounting substrate. |
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| Keywords: | printed circuit board mounting substrate external inspection technology |
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