| LTCC层压工艺及设备 |
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| 引用本文： | 李晓燕,冯哲,张建宏. LTCC层压工艺及设备[J]. 电子工业专用设备, 2012, 41(10): 24-26,42 |
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| 作者姓名： | 李晓燕 冯哲 张建宏 |
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| 作者单位： | 中国电子科技集团公司第二研究所,山西太原,030024 |
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| 摘 要： | 层压是LTCC工艺中继切片、冲孔、填充、印刷、叠片之后的工序,层压之后再经过热切、烧结成为LTCC成品。介绍了LTCC层压的原理和工艺及3种加压曲线。根据LTCC层压工艺要求,阐述了层压机的研发。
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| 关 键 词： | 低温共烧陶瓷(LTCC) 层压(等静压) 层压机 |
The Research of Laminating Process and the Development of Machine |
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| LI Xiaoyan,FENG Zhe,ZHANG Jianhong. The Research of Laminating Process and the Development of Machine[J]. Equipment for Electronic Products Marufacturing, 2012, 41(10): 24-26,42 |
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| Authors: | LI Xiaoyan FENG Zhe ZHANG Jianhong |
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| Affiliation: | (The 2nd Research Insitute of CETC, Taiyuan 030024, China) |
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| Abstract: | The laminating is one of LTCC process after cutting, punching, truing, prlnnng anu stacking. The final stage is heat cutting and co-firing. This paper introduces the principle and process of LTCC laminating. Three laminating curve is mentioned. According to LTCC laminating process requirements, the development of the laminator is described in detail, uses water to uniformly distribute the force of lamination. |
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| Keywords: | LTCC (Low Tempture Co-fired Ceramic) Laminating Laminator |
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