| 温度试验条件下柱栅阵列仿真失效分析 |
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| 引用本文： | 苏德志,赵丹,王岑.温度试验条件下柱栅阵列仿真失效分析[J].微电子学,2020,50(1):65-71. |
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| 作者姓名： | 苏德志 赵丹 王岑 |
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| 作者单位： | 山东航天电子技术研究所, 山东 烟台 264000 |
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| 基金项目： | 国家自然科学基金资助项目(51375511) |
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| 摘 要： | 陶瓷柱栅阵列(CCGA)封装是陶瓷球栅阵列(CBGA)封装的衍生技术,能有效缓解CBGA因热失配而引起的失效问题。对CCGA1140封装的材料和结构进行建模,针对焊接过程和热环境试验仿真条件下柱栅阵列焊点的应力应变分布情况和薄弱环节进行重点论述。仿真结果表明,在焊接和热环境中,CCGA封装最薄弱环节是柱栅阵列最外侧四角的焊点处。
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| 关 键 词： | 陶瓷柱栅阵列 热失配 应力应变 |
| 收稿时间： | 2019/9/30 0:00:00 |
Failure Analysis of Column Grid Array Under Temperature Test |
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| SU Dezhi,ZHAO Dan,WANG Cen.Failure Analysis of Column Grid Array Under Temperature Test[J].Microelectronics,2020,50(1):65-71. |
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| Authors: | SU Dezhi ZHAO Dan WANG Cen |
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| Affiliation: | Shandong Institute of Space Electronic Technology, Yantai, Shandong 264000, P. R. China |
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| Abstract: | Ceramic columnar grid array (CCGA) is the derivative technology of ceramic ball grid array (CBGA), which can effectively solve the failure problem due to thermal mismatch for CBGA. By modeling the material and structure of CCGA1140, the stress-strain distribution and weak links of solder joints were emphatically discussed under welding process and thermal environment. The results showed that the solder joints in the outermost corners of cylindrical grid array were the weakest position of CCGA package under welding process and thermal environment. |
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| Keywords: | CCGA thermal mismatch stress-strain |
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