| PCB装配过程爆板之失效诊断 |
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| 引用本文： | 李旭沐,陈碧兰. PCB装配过程爆板之失效诊断[J]. 印制电路信息, 2007, 0(11): 46-54 |
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| 作者姓名： | 李旭沐 陈碧兰 |
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| 作者单位： | 汕头超声印制板公司,广东汕头,515041 |
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| 摘 要： | 文章主要筛选作者处理的一些装配爆板案例进行归纳和逐一剖析,并加以简要论述其解决的对策,试图"对症下药",在装配中避免或改善存在的不良。
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| 关 键 词： | 爆板 印制板 |
| 文章编号： | 1009-0096(2007)11-0046-09 |
FFailure Diagnosis on PCB Delamination During Assembling |
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| Li Xumu,Chen Bilan. FFailure Diagnosis on PCB Delamination During Assembling[J]. Printed Circuit Information, 2007, 0(11): 46-54 |
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| Authors: | Li Xumu Chen Bilan |
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| Affiliation: | Li Xumu Chen Bilan |
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| Abstract: | This article is to summarize and analyze some delamination issues occurring during assembling, as well as to present their countermeasures, so as to pertinently eliminate or improve the defect during assembling. |
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| Keywords: | delamination PCB |
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