铜掺杂纳米 TiO2 的制备及其抗菌性能研究

目的制备铜掺杂纳米二氧化钛抗菌材料,测定其金属溶出率,研究该材料的光催化活性及抗菌性能。方法通过水热合成法制备掺铜二氧化钛(TiO_2Cu)纳米材料,采用催化动力学法测定该材料Cu~(~(2+))溶出率,以亚甲蓝为光催化降解材料测定其光催化活性,以金黄色葡萄球菌为目标物,研究在紫外光和非光条件下TiO_2Cu纳米材料的抗菌性能。结果 TiO_2Cu纳米材料Cu~(2+)溶出率最大值为72.36%,在自然光和紫外灯光照下对亚甲蓝光催化降解率分别为95.06%和85.08%,光照下TiO_2Cu材料质量浓度达到10 mg/m L,与细菌共培养90 min后,抑菌率可达94%。结论采用冷冻干燥法制备的含铜量为0.2%的TiO_2Cu材料具有良好的光催化活性,在暗光和紫外光照下均具有一定的抗菌性能。

Preparation of Copper Doped Nanometer Titanium Dioxide and Its Antibacterial Properties

This work aimed to prepare copper doped nano TiO2 antibacterial material, determine its metal dissolution rate and study its photocatalytic activity and antibacterial properties. Copper doped titanium dioxide (TiO2&Cu) nano material was prepared by hydrothermal synthesis, The catalytic kinetics of standard curve method was used to determine the copper ion dissolution rate of the material. The photocatalytic activity was determined using methylene blue as the photodegradation material. The antibacterial properties were studied under natural light and ultraviolet light irradiation using Staphylococcus aureus(ATCC25923) as the experimental bacteria. The copper ion dissolution rate reached the maximum of 72.36% on the fourth day. Under natural light and ultraviolet light irradiation, the degradation rate of methylene blue was 95.06% and 85.08%, respectively. The concentration of the material reached 10 mg/ml under light irradiation, and the bacterial inhibition rate was 94% after 90 min incubation. The TiO2&Cu material containing 0.2% Cu prepared by freeze-drying method had a good photocatalytic activity and good antibacterial properties in both the dark condition and under ultraviolet irradiation.