| 印刷电路板化学镀铜液回收EDTA的研究 |
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| 引用本文： | 陈世荣,郑伟强,陈志传,廖蔚峰. 印刷电路板化学镀铜液回收EDTA的研究[J]. 广东工业大学学报, 2005, 22(3): 21-24,33 |
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| 作者姓名： | 陈世荣 郑伟强 陈志传 廖蔚峰 |
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| 作者单位： | 1. 广东工业大学,轻工化工学院,广东,广州,510090
2. 深圳市危险废物处理站,广东,深圳,518049 |
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| 摘 要： | 介绍一种印刷电路板化学镀铜废液回收EDTA的方法.利用化学镀铜废液中残留的HCHO,采用在强碱条件下还原除铜,调整废液的pH回收EDTA.该方法Cu的去除率达99.6%,EDTA的回收率大于98%;用回收的EDTA制备EDTA-Na2,纯度大于98.5%.实现化学镀铜废液的回收和循环使用.
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| 关 键 词： | 印刷电路板 化学镀铜 回收利用 |
| 文章编号： | 1007-7162（2005）03-0021-04 |
| 收稿时间： | 2004-01-06 |
| 修稿时间： | 2004-01-06 |
The Recovery of EDTA in Waste PCB Chemical-copper Solution |
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| CHEN Shi-rong,ZHENG Wei-qiang,CHEN Zhi-chuan,LIAO Wei-feng. The Recovery of EDTA in Waste PCB Chemical-copper Solution[J]. Journal of Guangdong University of Technology, 2005, 22(3): 21-24,33 |
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| Authors: | CHEN Shi-rong ZHENG Wei-qiang CHEN Zhi-chuan LIAO Wei-feng |
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| Abstract: | In this paper copper is reduced by formaldehyde which is contained in the wastewater of chemical copper plating. The EDTA acid can be recycled after acidulation. Using EDTA, EDTA-Na2 and new chemical copper plating solution are prepared. It is shown that the removal rate of copper is 99.6%. The EDTA recovery is more than 98%, and the purity of EDTA-Na2 which is made from EDTA is more than 98.5%. It can be used in industrys of chemical copper plating again. |
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| Keywords: | EDTA |
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