| 纳米结构强化无铅焊点的力学性能 |
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| 引用本文： | 刘彬,邰枫,郭福,夏志东,史耀武.纳米结构强化无铅焊点的力学性能[J].复合材料学报,2009,26(2):11-17. |
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| 作者姓名： | 刘彬 邰枫 郭福 夏志东 史耀武 |
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| 作者单位： | 北京工业大学,材料科学与工程学院,电子组装研究与测试中心,北京,100022 |
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| 基金项目： | 北京市科技新星计划B类，霍英东青年教师基金 |
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| 摘 要： | 新型的无铅钎料不仅要具备含铅钎料的工艺性能，更重要的是要有更高的力学性能，特别是焊接接头的抗蠕变能力。将纳米级多面齐聚倍半硅氧烷(Polyhedral oligomeric silsesquioxanes，POSS)颗粒作为增强相添加到基体钎料中，能够有效地改善Sn-3. 5Ag基复合钎料的性能。研究了不同种类POSS增强颗粒对Sn-3. 5Ag钎料显微组织和力学性能的影响，确定出POSS增强颗粒复合钎料的最佳配比，并对最佳配比复合钎料在不同温度不同载荷条件下的蠕变寿命进行了研究。结果表明：POSS颗粒质量分数小于2%时，可以抑制基板界面处初晶金属间化合物的生长；复合钎料的抗剪切强度明显提高；低温时，最大蠕变寿命明显改善。
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| 关 键 词： | POSS增强颗粒 显微组织 力学性能 蠕变寿命 |
| 收稿时间： | 2008-04-21 |
| 修稿时间： | 2008-09-18 |
Mechanical properties of lead-free solder joint containing nano-structured reinforcements |
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| LIU Bin,TAI Feng,GUO Fu,XIA Zhidong,SHI Yaowu.Mechanical properties of lead-free solder joint containing nano-structured reinforcements[J].Acta Materiae Compositae Sinica,2009,26(2):11-17. |
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| Authors: | LIU Bin TAI Feng GUO Fu XIA Zhidong SHI Yaowu |
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| Affiliation: | (College of Materials Science and Engineering, Beijing University of Technology, Center for Electronic Packaging Research and Testing, Beijing 100022, China) |
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| Abstract: | The newly developed lead-free solders should have good mechanical properties,as well as excellent creep resistance in order to meet the needs of reliability required by electronic industries.Nano-sized polyhedral oligomeric silsesquioxane (POSS) reinforcement particles were incorporated into the promising lead-free solder,Sn-3.5Ag,to improve the mechanical property of the lead-free solder.Experimental results show that the thickness of intermetallic compound(IMC) layer between solder and substrate Cu is res... |
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| Keywords: | POSS reinforcement particle microstructure mechanical performance creep rupture life |
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