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MCM-C金属气密封装技术
引用本文:何中伟,李寿胜.MCM-C金属气密封装技术[J].电子与封装,2006,6(9):1-6.
作者姓名:何中伟  李寿胜
作者单位:华东光电集成器件研究所,安徽,蚌埠,233042;华东光电集成器件研究所,安徽,蚌埠,233042
摘    要:在介绍MCM-C常用金属气密封装方法的基础上,重点对MCM-C封装中工程实用性强、应用较多的平行缝焊密封工艺技术、链式炉钎焊密封工艺技术以及密封前的真空烘烤技术进行了较深入的研讨。实验结果表明,采用文中所述的MCM-C金属气密封装技术所封装的金属外壳封装MCM-C、一体化PGA封装MCM-C产品,在经受规定的环境试验、机械试验后,其结构完整性、电学有效性、机械牢固性、封装气密性均能很好地满足要求。

关 键 词:MCM-C  金属气密封装  平行缝焊  钎焊  真空烘烤
文章编号:1681-1070(2006)09-0001-06
收稿时间:2006-03-06
修稿时间:2006年3月6日

MCM-C Hermetically Metal Sealing Techniques
HE Zhong-wei,LI Shou-sheng.MCM-C Hermetically Metal Sealing Techniques[J].Electronics & Packaging,2006,6(9):1-6.
Authors:HE Zhong-wei  LI Shou-sheng
Affiliation:East China Institute of Photo-Electron IC , Bengbu 233042 China
Abstract:On the basis of the introduction of MCM-C's common hermetically metal sealing methods,the paper puts stress on the relatively deepgoing studies in parallel seam sealing process technique,belt furnace brazing sealing process technique and pre-sealing vacuum baking technique which are very engineering practi- cal and are widely used in MCM-C packaging.Our experiments indicate that,after a set of necessary environ- mental and mechanical tests,the metal package sealed MCM-C and integral PGA packaged MCM-C prod- ucts using the MCM-C hermatically metal sealing techniques stated in this paper are able to meet the require- ments very well in their structural integrity,electrical efficiency,mechanical firmness and sealing hermetization.
Keywords:MCM-C
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