| 化学镀镍技术在电子工业的应用 |
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| 引用本文： | 余德超,谈定生,王松泰.化学镀镍技术在电子工业的应用[J].电镀与涂饰,2007,26(4):42-45. |
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| 作者姓名： | 余德超 谈定生 王松泰 |
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| 作者单位： | 上海大学材料科学与工程学院,上海,200072 |
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| 摘 要： | 化学镀镍层具有耐蚀性好、耐磨性高、焊接性良好、磁性可调等优点。因此,化学镀镍技术被广泛应用于电子工业。文章概述了化学镀镍的原理、常用的化学镀镍-磷合金工艺配方及各成分的作用,简述了化学镀镍技术在PCB制造、电子封装、电子元件制造、电磁屏蔽等领域的应用,介绍了近年来的化学镀镍新技术,并指出了今后化学镀镍技术的研究重点。
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| 关 键 词： | 化学镀镍 电子工业 PCB制造 电子封装 电子元件制造 电磁屏蔽 |
| 文章编号： | 1004-227X（2007）04-0042-04 |
| 修稿时间： | 2006-08-092006-09-05 |
Applications of electroless nickel plating in electronics industry |
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| YU De-chao,TAN Ding-sheng,WANG Song-tai.Applications of electroless nickel plating in electronics industry[J].Electroplating & Finishing,2007,26(4):42-45. |
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| Authors: | YU De-chao TAN Ding-sheng WANG Song-tai |
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| Affiliation: | School of Material Science and Engineering, Shanghai University, Shanghai 200072, China |
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| Abstract: | Electroless nickel plating technologies were widely applied in electronics industry for electroless deposit's good corrosion resistance,high abrasion resistance,excellent solderability,adjustable magnetism,etc.The mechanism of electroless nickel plating and components and their roles of the common electroless Ni-P alloy bath were summarized.The applications of the electroless nickel plating in areas of the PCB manufacturing,electronic packaging,the electronic components fabricating and electromagnetic shielding were discussed briefly.Some new technologies of electroless nickel plating were introduced.The research emphases of the electroless nickel plating technologies were presented. |
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| Keywords: | electroless nickel plating electronics industry PCB manufacture electronic package electronic components fabrication electromagnetic shielding |
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