| 缠绕用无溶剂低温固化双马来酰亚胺树脂体系 |
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| 引用本文： | 张敏,杨洋,雷毅. 缠绕用无溶剂低温固化双马来酰亚胺树脂体系[J]. 热固性树脂, 2007, 22(1): 1-4 |
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| 作者姓名： | 张敏 杨洋 雷毅 |
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| 作者单位： | 四川大学高分子科学与工程学院,四川大学高分子材料工程国家重点实验室,四川,成都,610065;四川大学高分子科学与工程学院,四川大学高分子材料工程国家重点实验室,四川,成都,610065;四川大学高分子科学与工程学院,四川大学高分子材料工程国家重点实验室,四川,成都,610065 |
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| 摘 要： | 在乙烯基苄基化合物改性双马来酰亚胺树脂体系中添加烯丙基苯酚活性稀释剂,得到了粘度小于1000 mPa·s,加工适用期大于8 h,在150～155℃完成固化与后固化、适用于缠绕成型工艺的树脂体系。增韧改性后,该树脂的玻璃化转变温度达到261℃,拉伸强度和弯曲强度分别为73 MPa和133 MPa。
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| 关 键 词： | 双马来酰亚胺 缠绕成型 低温固化 活性稀释剂 |
| 文章编号： | 1002-7432（2007）01-0001-04 |
| 收稿时间： | 2006-08-17 |
| 修稿时间： | 2006-09-20 |
Investigation on low-temperature setting bismaleimide resin system for filament winding |
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| ZHANG Min,YANG Yang,LEI Yi. Investigation on low-temperature setting bismaleimide resin system for filament winding[J]. Thermosetting Resin, 2007, 22(1): 1-4 |
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| Authors: | ZHANG Min YANG Yang LEI Yi |
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| Affiliation: | College of Polymer Science and Engineering , State Key Laboratory of Polymer Materials Engineering, Sichuan University , Chengdu 610065, China |
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| Abstract: | A vinylbenzyl compound/BMI resin system with viscosity less than 1000 mPa's,long pot life more than 8 h and outstanding low-temperature curing property finished at 150～155℃was obtained by employing substituted diallylphenol derivatives as reactive diluent.The resin was particularly useful in filament winding technique.The cured resin had excellent thermal and mechanical properties,such as Tg was 261℃,its tensile and beding strnengch were 73 MPa and 133MPa separately. |
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| Keywords: | bismaleimide filament winding low-temperature setting reactive diluent |
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