| 一种挠性印制电路基板的研制 |
| |
| 引用本文： | 王劲,唐屹,曾晓丹,王剑,谢美丽.一种挠性印制电路基板的研制[J].电子元件与材料,2007,26(2):34-36. |
| |
| 作者姓名： | 王劲 唐屹 曾晓丹 王剑 谢美丽 |
| |
| 作者单位： | 高分子材料工程国家重点实验室,四川大学高分子科学与工程学院,四川,成都,610065 |
| |
| 基金项目： | 国家高技术研究发展计划(863计划) |
| |
| 摘 要： | 以脂肪族二胺、芳香杂环二胺和芳香四羧酸二酐或芳香四羧酸二酐、芳香族二胺为原料,N-甲基吡咯烷酮为溶剂,合成两种聚酰胺酸。逐层涂覆,制备了表面为热可塑聚酰亚胺的三层聚酰亚胺复合膜,与铜箔热压复合制备了双面覆铜挠性印制电路基板。热塑性聚酰亚胺胶的玻璃化转变温度为133℃,三层聚酰亚胺复合膜的结晶熔融温度为222℃。该挠性印制电路基材平均剥离强度为7.1 N/cm。
|
| 关 键 词： | 电子技术 挠性印制电路(FPC) 热可塑聚酰亚胺 结晶 |
| 文章编号： | 1001-2028（2007）02-0034-03 |
| 修稿时间： | 2006-10-17 |
Preparation of flexible printed circuits board |
| |
| WANG Jin,TANG Yi,ZENG Xiao-dan,WANG Jian,XIE Mei-li.Preparation of flexible printed circuits board[J].Electronic Components & Materials,2007,26(2):34-36. |
| |
| Authors: | WANG Jin TANG Yi ZENG Xiao-dan WANG Jian XIE Mei-li |
| |
| Abstract: | Two kinds of polyamic acids(PAA) were prepared by aliphatic diamine,aromatic diamine and aromatic dianhydride in NMP(N-methyl pyrrolidone).The PAA solution was cast one by one and thermal-imidized.On the basis of this procedure,three-layer polyimide films were prepared with thermoplastic polyimide on the surface layer.Double-sided FCCL(flexible copper clad laminates) was prepared by hot-pressing with copper foils.The results shown for thermoplastic polyimide film,the glass transition temperature is 133 ℃,the crystal melt temperature of threelayer polyimide film is 222 ℃.The mean peel strength of FCCL between polyimide films and copper foils is 7.1 N/cm. |
| |
| Keywords: | electron technology flexible printed circuit(FPC) thermoplastic polyimide crystalline |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
