| 一种环氧树脂封装方法 |
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| 引用本文： | 王保卫,杨渊华.一种环氧树脂封装方法[J].电子与封装,2006,6(11):10-11. |
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| 作者姓名： | 王保卫 杨渊华 |
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| 作者单位： | 中国电子科技集团公司第五十五研究所,南京,210016;中国电子科技集团公司第五十五研究所,南京,210016 |
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| 摘 要： | 全陶瓷器件的封装大多采用环氧树脂进行密封,而对批量生产的器件来说,必须在保证封装气密性的同时又能高效地操作。文中介绍了一种封装实例,选用室温为固态、90℃以上为液态的环氧树脂,在管帽上先涂敷环氧树脂,设计了一套特种夹具,采用加压固化法保证封装器件的气密性,实现了全陶瓷器件封装的批量生产。
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| 关 键 词： | 环氧树脂 全陶瓷封装 封装 |
| 文章编号： | 1681-1070（2006）11-0010-02 |
| 收稿时间： | 2006-02-10 |
| 修稿时间： | 2006年2月10日 |
A Packaging Method of Epoxy Resin |
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| WANG Bao-wei,YANG Yuan-hua.A Packaging Method of Epoxy Resin[J].Electronics & Packaging,2006,6(11):10-11. |
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| Authors: | WANG Bao-wei YANG Yuan-hua |
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| Affiliation: | China Electronics Technology Group Corporation No.55 Research Institute, Nanjing 210016, China |
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| Abstract: | Most of the full ceramic device is packaged by epoxy resin.But it's different thing for packaging a batch production of device,because it's necessary to ensure the device's encapsulation,and operating efficiency. This article is talking about an example of package.We collect a kind of epoxy resin,it's solid state below 90℃, and it's liquid state above 90℃.Coating epoxy resin on the ceramic cap,using a set of special jig,putting a pressure on the device then solidifying,ensuring the device's encapsulation,a batch production of full ceramic device is come true. |
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| Keywords: | epoxy resin full ceramic device packaging |
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