金刚石线锯切割多晶硅表面形貌特征分析

采用自制的实验设备研究电镀金刚石线锯对硬脆材料多晶硅的锯切实验,使用日本VHX-1000C型超景深三维显微系统对多晶硅切片的表面形貌特征进行研究,分析了工件进给速度和预平衡力大小以及是否施加超声对锯切表面粗糙度的影响。研究结果表明:多晶硅切片表面主要由较长较深沟槽、较浅划痕、大量表面破碎及少量较大较深的凹坑构成。另外,随着工件进给速度的增大,硅片的表面粗糙度值变大;而预平衡力加大会使硅片表面粗糙度值变小;施加超声振动可以明显提高加工效率、减小硅片表面粗糙度值。

Surface morphology characteristics analysis of diamond wire saw cutting polysilicon

In this test, self-made test equipment is applied to carry on electroplated diamond wire saw cutting experiment of hard and brittle materials polysilicon, and Japanese VHX-IO00C ultra-precision three-dimensional microscopy system is used to study on polysilicon slice surface morphology. Besides, the influence of the workpiece speed, pre-equipoise force and ultrasound on sawing surface roughness is analyzed. The results show that the surface of polycrystalline silicon slice is mainly composed of long deep grooves, shallow scratches, a large amount of surface crushings and a small amount of large deep pits. In addition, with the increase of workpiece feed speed, silicon wafer surface roughness values becomes larger; while its balance force increase will make the silicon wafer surface roughness value smaller. Applying ultrasonic vibration can significantly improve the processing efficiency, reduce the silicon wafer surface roughness values.