| 金刚石线切割单晶碳化硅锯切力的实验研究 |
| |
| 引用本文： | 张玉兴,黄辉,徐西鹏. 金刚石线切割单晶碳化硅锯切力的实验研究[J]. 金刚石与磨料磨具工程, 2014, 0(1): 6-9,14 |
| |
| 作者姓名： | 张玉兴 黄辉 徐西鹏 |
| |
| 作者单位： | 华侨大学脆性材料加工技术教育部工程研究中心,厦门361021 |
| |
| 基金项目： | 基金项目：国家自然科学基金（51375179,U1034006）;长江学者与创新团队发展计划（IRT1063）;福建省杰出青年基金（2011J06021）;中央高校基本科研业务费（JB-GJ1003）. |
| |
| 摘 要： | 从锯切力的角度对金刚石线锯锯切单晶SiC材料的加工过程进行了研究。得出了线速度、进给速度、线锯张紧力对锯切力的影响规律。从单位长度线锯材料去除量、锯切比能的角度讨论了锯切工艺对锯切力的影响机理。在金刚石线锯锯切单晶SiC过程中,锯切力随着线速度的增大而减小,随着进给速度的增大而增大,线速度与进给速度对锯切力的综合影响表现为:单位长度线锯材料去除量的增加会增大锯切力。单位长度线锯材料去除量对于金刚石线锯锯切单晶SiC材料的锯切比能具有显著的影响。
|
| 关 键 词： | 金刚石线锯 单晶SiC 锯切力 单位长度线锯材料去除量 比能 |
Investigation of sawing force about diamond wire sawing single crystal silicon carbide |
| |
| ZHANG Yu-xing,HUANG Hui,XU Xi-peng. Investigation of sawing force about diamond wire sawing single crystal silicon carbide[J]. Diamond & Abrasives Engineering, 2014, 0(1): 6-9,14 |
| |
| Authors: | ZHANG Yu-xing HUANG Hui XU Xi-peng |
| |
| Affiliation: | (Engineering Research Center for Brittle Materials Huaqiao University, Xiamen Machining, Ministry of Education 361021, China) |
| |
| Abstract: | Cutting force during diamond wire cutting single crystal silicon carbide is investigated. The influences of wire speed, feed rate and tension force on cutting force are studied. Influencing mechanisms of sawing parameters, such as material removal per length and specific energy, on cutting force are discussed. When diamond wire saw is cutting single crystal silicon, cutting force decreases with the increase of wire speed, and increases with the increase of feed rate. The increase of material removal per length can increase the cutting force and have a significant influence on specific energy when sawing single crystal SiC. |
| |
| Keywords: | diamond wire saw single crystal silicon carbide cutting force material removal with per length wire special energy |
| 本文献已被 CNKI 维普 等数据库收录！ |
