铜电解精炼阴极表面长粒子的原因及粒子的消除

通过实验, 分析了电解精炼时阴极铜表面长粒子的原因。确定了电解液添加剂的最佳加入量为:盐酸25 mg/L;硫脲起始加入量为5.6 mg/L, 每生产1 t Cu 补加量为73 g;胶起始加入量为8 mg/L, 每生产1 t Cu 补加量为120 g 。在添加剂用量适当的条件下, 对电解液进行循环和过滤, 可以基本消除阴极铜表面长粒子的现象, 得到的阴极铜表面粗糙度下降, 纯度提高。

Particle Formation and Elemination on Cathodic Surface in Copper Electralytic Refine

The causes for particle formation on the cathodic surface in copper electrolytic refine were analysed based on the experimental results and the amount of additives were optimized to be: hydrochloric acid 25 mg/L, thiourea starting with 5 6 mg/L and comsuming 73 g per ton of metallic copper, glue starting with 8 mg/L and comsuming 120 g per ton of metallic copper. The phenomenon of particle formation on the cathodic surface could not occurr by cycling and filtering the electrolytic solution with appropricate amount of additions, leading to the decrease of the cathodic surface roughness and improvement of the copper purity.