等离子蚀刻挠性PI基材制作悬空引线及其参数优化

悬空引线的制作是挠性印制线路板制作的难点之一，需要在基材的某些区域蚀刻掉PI（聚酰亚胺）基材来满足设计的要求。目前采用的在基材上开窗口的方法有机械冲切、数控铣、化学试剂蚀刻法和等离子蚀刻法等。其中，等离子蚀刻法加工精度高、操作简便、清洁环保，但由于运行成本相对较高使其生产应用受到了限制。本文通过正交设计试验优化等离子蚀刻PI的参数，以达到充分利用气体、缩短等离子蚀刻时间的目的，从而大大降低等离子蚀刻过程的成本。并最终完成悬空引线的制作。

Plasma Etching and Parameters Optimizing for Flexible PI Substrate to Produce Flying Lead

The production of flying lead is one of the difficulties in the production of flexible printed circuit boards.It needs to etch the PI(polyimide) substrate in certain areas to meet the requirements of design.At the present time,there are processes of punching,numerical control milling,chemical etching and plasma etching to open windows on the PI substrate.Among them,the plasma etching process is highly accurate,easy to operate and clean to environment,but relatively high operating cost limiting the production.In this paper,we use orthogonal design to optimize parameters of plasma etching PI process to make full use of plasma gas,shorten the time for plasma etching process and greatly reduce the cost of plasma etching process.Finally,we complete the production of the flying lead.