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沉积温度对脉冲真空弧源沉积类金刚石薄膜性能的影响
引用本文:冷永祥,孙永春,孙鸿,陈俊英,王进,黄楠. 沉积温度对脉冲真空弧源沉积类金刚石薄膜性能的影响[J]. 机械工程学报, 2004, 40(7): 20-23
作者姓名:冷永祥  孙永春  孙鸿  陈俊英  王进  黄楠
作者单位:西南交通大学材料科学与工程学院
基金项目:国家自然科学基金(No.303707,30300087),国家重点基础研究(G1999064706),国家高技术研究发展计划(102-12-09-1)资助项目。
摘    要:利用脉冲真空弧源沉积技术在Cr17Ni14Cu4不锈钢和Si(100)基体上制备了类金刚石(DLC)薄膜,研究了基体沉积温度对DLC薄膜的性能和结构的影响。研究表明,随着沉积温度由100 ℃提高到400 ℃,DLC薄膜中sp3 键质量分数减少,sp2键质量分数增多,薄膜复合硬度逐渐降低。当DLC薄膜沉积温度达到400 ℃时,薄膜中C原子主要以sp2键形式存在,与沉积温度为100 ℃时制备的DLC薄膜相比,薄膜复合硬度降低50%。DLC薄膜具有优异的耐磨性,摩擦因数低,随着沉积温度由100 ℃提高到400 ℃,Cr17Ni14Cu4不锈钢表面沉积的DLC薄膜耐磨性降低。沉积温度为100 ℃时,Cr17Ni14Cu4不锈钢表面沉积的DLC薄膜后,耐磨性大幅度提高。DLC薄膜与不锈钢基体结合牢固。

关 键 词:X光电子能谱  基体温度  类金刚石  脉冲真空弧源沉积  耐磨性  显微硬度  
修稿时间:2003-01-22

EFFECT OF SUBSTRATE TEMPERATURE ON PROPERTIES OF THE DIAMOND-LIKE CARBON DEPOSITED BY PULSED VACUUM ARC PLASMA DEPOSITION
Leng Yongxiang Sun Yongchun Sun HongChen Junying Wang Jin Huang Nan. EFFECT OF SUBSTRATE TEMPERATURE ON PROPERTIES OF THE DIAMOND-LIKE CARBON DEPOSITED BY PULSED VACUUM ARC PLASMA DEPOSITION[J]. Chinese Journal of Mechanical Engineering, 2004, 40(7): 20-23
Authors:Leng Yongxiang Sun Yongchun Sun HongChen Junying Wang Jin Huang Nan
Affiliation:School of Materials Science&Engineering, Southwest Jiaotong University
Abstract:Diamond-like carbon(DLC) films are deposited on Cr17Ni14Cu4 stainless steel and Si(100) substrates as a function of substrate temperature by pulsed vacuum arc plasma deposition. The results show that the sp3 carbon atoms content decreas as the substrate temperature increases. The microhardness of DLC films decrease when the substrate temperature increases. The DLC films which are deposited at 100℃ to 300℃ have the low friction coefficient and good wear resistance. The wear resistance of the DLC films deposites on Cr17Ni14Cu4 substrate is much better than that of Cr17Ni14Cu4 stainless steel. But the wear resistance decreases as the substrate temperature increases and the DLC film deposites at 400℃ has low wear resistance. The DLC films have good adherence with the stainless steel substrate.
Keywords:Diamond-like carbon Wear resistance Pulsed vacuum arc plasma deposition Microhardness Substrate temperature X-ray photoelectron spectroscopy
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