| 硫酸盐型亚光纯锡电镀工艺在PCB上的应用 |
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| 引用本文： | 罗维,张学军.硫酸盐型亚光纯锡电镀工艺在PCB上的应用[J].印制电路信息,2004(6):31-33. |
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| 作者姓名： | 罗维 张学军 |
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| 作者单位： | 成都开华化工研究所,610041 |
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| 摘 要： | 介绍了硫酸盐型亚光纯锡电镀工艺,并就该工艺在PCB上应用时各工艺参数如电流效率、添加剂工艺配方等影响进行了讨论。用该工艺取代PCB制造通常使用的氟硼酸体系工艺作为图形蚀刻时的保护镀层,不仅利于环保,而且质量稳定可靠,具有极佳的性价比,是达到电子产品无铅化的首选工艺。
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| 关 键 词： | 硫酸盐型亚光纯锡电镀工艺 电流效率 添加剂 印制线路板 |
Sulfate Satin Pure Tin Plating Process Used in PCB |
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| Luo Wei Zhang Xuejun.Sulfate Satin Pure Tin Plating Process Used in PCB[J].Printed Circuit Information,2004(6):31-33. |
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| Authors: | Luo Wei Zhang Xuejun |
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| Affiliation: | Luo Wei Zhang Xuejun |
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| Abstract: | Sulfate satin pure tin plating process is introduced, plating parameters (current efficiency, formula of additive) in used of PCB are discussed. Shift from fluorboric acid tin-lead plating process to sulfate satin pure tin plating process used of etch resist in PCB. It's easy effluent disposal, properties stability, low cost, one of the best processes in coures of lead-free component finishes. |
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| Keywords: | sulfate satin pure tin plating process current efficiency additive PCB |
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