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The effect of coating crystallization and substrate impurities on magnetron sputtered doped LaCrO3 coatings for metallic solid oxide fuel cell interconnects
Authors:Christopher Johnson  Nina Orlovskaya  Anthony Coratolo  Caleb Cross  Junwei Wu  Randall Gemmen  Xingbo Liu
Affiliation:1. National Energy Technology Laboratory, DOE, Morgantown, WV 26507, USA;2. Department of Mechanical, Materials, and Aerospace Engineering, University of Central Florida, Orlando, FL 32816, USA;3. Department of Materials Engineering, Drexel University, Philadelphia, PA 19104, USA;4. Mechanical and Aerospace Department, West Virginia University, WV 26505, USA
Abstract:For IT-SOFC metallic interconnects, surface coating is effective for reducing Cr poisoning of the cathode and controlling scale growth. In this work, LaCrO3 and doped LaCrO3 coatings were deposited by magnetron sputtering on SS446 and Crofer 22 APU substrates. The crystallization process was studied by means of X-ray Diffraction (XRD) during the annealing of the sputter coated samples in ambient and reducing environments. The formation of intermediate phases when annealed in air, LaCrO4 and La2CrO6, results in vacancy formation upon subsequent transformation to the LaCrO3 phase and thus a decreased oxidation resistance. While the avoidance of an intermediate phase change when the coatings are initially annealed in a reducing environment leads to dense and compact coatings. This confirmed both by XRD and by scanning electron microscopy (SEM) of coating cross-sections. Crofer 22 APU alloys with various silicon and aluminum levels are deposited with doped LaCrO3 coating to study substrate impurity effects on coating properties. It was found that silicon content in the substrates leads to increased ASR of the coatings. In addition, long term annealing in air shows that aluminum impurities in the substrate can lead to the formation of alumina at substrate grain boundaries, which in turn leads to enhanced Mn migration at the grain boundaries. Increased manganese concentrations at the film/grain boundary interface in coated samples produces larger than normal amounts of (Mn,Cr)3O4 spinel in these regions, which cracks the coating and reduces the ASR value due to extra electronic conduction path. A similar mechanism is not observed in a low Al/Si alloy.
Keywords:SOFC   Interconnect   Impurities   Coatings
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