| 绿色无铅电子焊料的研究与应用进展 |
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| 引用本文： | 张曙光,何礼君,张少明,石力开.绿色无铅电子焊料的研究与应用进展[J].材料导报,2004,18(6):72-75. |
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| 作者姓名： | 张曙光 何礼君 张少明 石力开 |
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| 作者单位： | 北京有色金属研究总院,北京,100088;北京有色金属研究总院,北京,100088;北京有色金属研究总院,北京,100088;北京有色金属研究总院,北京,100088 |
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| 基金项目： | 国家高技术研究发展计划(863计划) |
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| 摘 要： | 概述了关于无铅电子焊料全球范围的立法与研发计划、国内外无铅焊料的发展现状及所取得的研究成果,探讨了无铅焊料合金的专利问题,进行了无铅软钎焊技术可行性、经济性和可靠性分析,介绍了无铅焊料的应用情况,并展望了前景.
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| 关 键 词： | 无铅焊料 微电子组装 焊接 应用 |
Progress of Research and Application of Lead-free Solder |
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| ZHANG Shuguang HE Lijun ZHANG Shaoming SHI Likai.Progress of Research and Application of Lead-free Solder[J].Materials Review,2004,18(6):72-75. |
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| Authors: | ZHANG Shuguang HE Lijun ZHANG Shaoming SHI Likai |
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| Abstract: | The global legal regulations on leaded solder and research and development programs on lead-freesolder around the world are briefly introduced.The progress and main achievements of lead-free solder are re-viewed.The patent problem on lead-free solder materials,the feasibility,economic aspect,and reliability of lead-freesoldering technology are analysed.The current status and future prospects of application of lead-free soldering are pre-sented. |
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| Keywords: | lead-free solder microeleetronic assembly technology soldering application |
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