| The Effect of Diffusion Barrier and Bombardment on Adhesive Strength of CuCr Alloy Films |
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| 作者姓名： | WANG Jian-fengl SONG Zhong-xiao XU Ke-wei' WANG Yuan' . State Key Laboratory for Mechanical Behavior of Materials Xi'an Jiaotong University Xi'an China . Key Lab for Physical Electronics and Devices Ministry of Education Xi 'an Jiaotong University Xi'an China |
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| 作者单位： | WANG Jian-fengl，SONG Zhong-xiao2，XU Ke-wei'，WANG Yuan' 1. State Key Laboratory for Mechanical Behavior of Materials，Xi'an Jiaotong University，Xi'an，China 2. Key Lab for Physical Electronics and Devices Ministry of Education，Xi 'an Jiaotong University，Xi'an，China |
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| 摘 要： | COPPER is a highly promising alternative material toaluminum-based alloys for the new generation of ULSIcircuits owing to its low electrical resistivity and highelectromigration resistance1.However,Cu line or filmcannot completely show its advantages since Cu caneasily diffuse into silicon substrate and the adhesivestrength between Cu and Si is not well enough in somecases.To alloy pure copper with small amounts ofsolutes can not only enhance the electromigrationresistance but also improv…
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The Effect of Diffusion Barrier and Bombardment on Adhesive Strength of CuCr Alloy Films |
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| WANG Jian-fengl,SONG Zhong-xiao,XU Ke-wei'''',WANG Yuan'''' . State Key Laboratory for Mechanical Behavior of Materials,Xi''''an Jiaotong University,Xi''''an,China . Key Lab for Physical Electronics and Devices Ministry of Education,Xi ''''an Jiaotong University,Xi''''an,China.The Effect of Diffusion Barrier and Bombardment on Adhesive Strength of CuCr Alloy Films[J].Transactions of Materials and Heat Treatment,2004,25(5). |
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| Authors: | WANG Jian-feng SONG Zhong-xiao XU Ke-Wei WANG Yuan |
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| Affiliation: | 1. State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an, China
2. Key Lab for Physical Electronics and Devices Ministry of Education, Xi'an Jiaotong University, Xi'an, China |
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| Abstract: | A novel co-sputtering method that combined magnetron sputtering (MS) with ion beam sputtering (IBS) was used to fabricate CuCr alloy films without breaking vacuum after depositing diffusion barrier with IBS. Different bombardment energies were used to improve the comprehensive properties of Cu alloy film. The results indicated that the effects of diffusion barriers and bombardment energy on adhesive strength could be evaluated by a rolling contact fatigue adhesion test. Diffusion barrier can enhance the adhesive strength, and the adhesion of CuCr/CrN was higher than that of CuCr/TiN. When bombarding energy was higher, the adhesive strength of CuCr/TiN films was higher due to the broader transition zone. |
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| Keywords: | CuCr alloy film Bombardment diffusion barrier adhesive strength |
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