| 陶瓷阵列封装的两种形式及其接头可靠性 |
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| 引用本文： | 张成敬,王春青. 陶瓷阵列封装的两种形式及其接头可靠性[J]. 电子工业专用设备, 2006, 35(8): 10-17 |
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| 作者姓名： | 张成敬 王春青 |
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| 作者单位： | 哈尔滨工业大学材料科学与工程学院,黑龙江,哈尔滨,150001;哈尔滨工业大学材料科学与工程学院,黑龙江,哈尔滨,150001 |
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| 摘 要： | 介绍了CBGA及CCGA的基本结构,对它们的优缺点进行了对比,分析了在热循环过程中,CBGA、CCGA封装结构产生的热应变及接头的热疲劳寿命,对目前接头热疲劳失效机理的分析进行了对比,总结了影响接头热疲劳寿命的几种因素。
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| 关 键 词： | CBGA CCGA 热循环 疲劳寿命 可靠性 |
| 文章编号： | 1004-4507(2006)08-0010-08 |
| 收稿时间： | 2006-08-02 |
| 修稿时间： | 2006-08-02 |
Overview on Two Types of Ceramic Array Package and Their Solder Joint Reliability |
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| ZHANG Cheng-jing,WANG Chun-qing. Overview on Two Types of Ceramic Array Package and Their Solder Joint Reliability[J]. Equipment for Electronic Products Marufacturing, 2006, 35(8): 10-17 |
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| Authors: | ZHANG Cheng-jing WANG Chun-qing |
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| Abstract: | The structures of CBGA and CCGA were presented.Advantages and drawbacks of the two packages were also compared.Thermal strain induced by thermal cycling was analyzed as well as the fatigue life of solder joints.The mechanism of thermal fatigue failure was further discussed.Several factors on the thermal fatigue life of solder joints were summarized. |
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| Keywords: | CBGA CCGA thermal cycling fatigue life reliability |
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