Effect of geometry and dielectric material on thermo-mechanical strain on micro-vias in build-up substrates

Build-up substrates have been preferable solutions for small and high performance systems for more than a few decades. Micro-vias need to be smaller to realize ever higher wiring density in build-up substrates, but there has been concern on the reliability. This paper focuses on Cu filled micro-vias of 25 μm in diameter and investigates the strain on micro-vias using a finite element method for varying geometric parameters and material properties. The strain becomes smaller with shrinking micro-vias, and a prediction equation for the strain is developed as a function of the aspect ratio and material properties for both single and stacked micro-vias.