Effect of Cr additions on the microstructural stability of Ni electrodes in ultra-thin BaTiO3 multilayer capacitors |
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Authors: | Anton V. Polotai Tae-Hee Jeong Gai-Ying Yang Elizabeth C. Dickey Clive A. Randall Pascal Pinceloup Abhijit S. Gurav |
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Affiliation: | (1) Center for Dielectric Studies, Department of Materials Science and Engineering, The Pennsylvania State University, University Park, PA 16802, USA;(2) KEMET Electronics Corporation, P.O. Box 849, Fountain Inn, SC 29644, USA |
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Abstract: | Microstructural control in thin-layer multilayer ceramic capacitors (MLCC) is one of the present day challenges to maintain an increase in capacitive volumetric efficiency. This present paper opens a series of investigations aimed to engineer the stability of ultra-thin Ni electrodes in BaTiO3-based multilayer capacitors using refractory metal additions to Ni. Here, pure Ni and Ni–1 wt.% Cr alloy powders are used to produce 0805-type BME MLCCs with 300 active layers and with dielectric and electrode layer thickness around 1 μm. To investigate the continuity of Ni electrodes, both MLCC chips with pure and doped electrodes were sintered at different temperatures for 5 h. It is found that the continuity of Ni electrodes is improved most likely due to the effect of Cr on the low-melting point (Ni,Ba,Ti) interfacial alloy layer formation. The interfacial alloy layer is not observed when Cr is segregated at Ni-BaTiO3 interface in the Cr-doped samples, while it is found in all undoped samples. The interfacial alloy layer is believed to increase mass-transfer along the Ni-BaTiO3 interfaces facilitating an acceleration of Ni electrodes discontinuities. |
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Keywords: | MLCC Nickel electrodes BaTiO3 Ni-BaTiO3 interfaces |
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