| 电子器件钎料无铅化的研究现状及展望 |
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| 引用本文： | 林鹏,杨思佳. 电子器件钎料无铅化的研究现状及展望[J]. 理化检验(物理分册), 2013, 0(11): 752-755,758 |
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| 作者姓名： | 林鹏 杨思佳 |
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| 作者单位： | 福州大学材料科学与工程学院,福州350000 |
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| 基金项目： | 福州大学科技发展基金资助项目（2012-XY-2） |
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| 摘 要： | 阐述了电子器件钎料无铅化的发展历程和研究现状，并通过对国内电子器件的焊点进行EDAX成分分析，研究钎料无铅化的实际应用现状。研究表明：当前国内电子器件所使用的钎料主要还是传统的锡一铅钎料，不过含铅量在逐渐下降。可见国内电子器件钎料无铅化已经起步，然而实现完全无铅化还有一段历程。
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| 关 键 词： | 电子器件 无铅钎料 研究现状 |
Research Status and Prospects of Lead-free Solder in Electronic Device |
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| LIN Peng,YANG Si-jia. Research Status and Prospects of Lead-free Solder in Electronic Device[J]. Physical Testing and Chemical Analysis Part A:Physical Testing, 2013, 0(11): 752-755,758 |
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| Authors: | LIN Peng YANG Si-jia |
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| Affiliation: | (College Of Materials Science and Engineering, Fuzhou University, Fuzhou 350000, China) |
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| Abstract: | The development process and research status of lead-free solder in electronic device were described, and through EDAX composition analysis of solder joints in the domestic electronic device, to study the actual application status of lead-free solder. It was showed that SwPb solder was still used in the current domestic electronic devices as the main solder, but the lead content was decreased year by year. It can clearly be seen, lead free solder have already started in the domestic electronic devices. However, to achieve complete lead free there is still a long way to go. |
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| Keywords: | electronic devices lead-free solder research status |
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