| 印制电路板铜导线断路修补方法的探索与应用 |
| |
| 引用本文： | 许秀恋,陈跃生. 印制电路板铜导线断路修补方法的探索与应用[J]. 印制电路信息, 2006, 0(2): 27-29 |
| |
| 作者姓名： | 许秀恋 陈跃生 |
| |
| 摘 要： | 以相关化学知识中的“银镜反应”和“电镀铜”等理论依据为切入点,建立全新的化学印制电路板断路修补模式。经过多次实验和总结,提出了一套用导电银浆作为打底导电层,用电刷镀铜为覆盖层的印制电路板铜导线断路修补路径。为企业减少了废品损失,同时减少了印制电路板生产过程中产生的固体废弃物对环境的污染。
|
| 关 键 词： | 导线断路 修补方法 压焊修补 银镜反应 电刷镀铜 |
Exploration and Application of the Mendable Method on the Conductive Circuit for PCB |
| |
| Xu Xiulian,Chen Yuesheng. Exploration and Application of the Mendable Method on the Conductive Circuit for PCB[J]. Printed Circuit Information, 2006, 0(2): 27-29 |
| |
| Authors: | Xu Xiulian Chen Yuesheng |
| |
| Affiliation: | Xu Xiulian Chen Yuesheng |
| |
| Abstract: | Based on silver-mirror reaction and plating copper, setting up a new mendakle methods of a break in the PCB. To rise a mendakle methods which useing conductive silver as conductive layer and brush-plating copper as covery layer through several experiments. |
| |
| Keywords: | open-circuits mendakle methods pressure welding mand silver-mirror reaction brush-plating copper |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
