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Thermal conductivity of adhesive filled with metal powders |
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| Authors: | R. Kilik R. Davies S.M.H. Darwish |
| Affiliation: | * Erciyes University, Turkey † University of Birmingham, UK ‡ Assiut University, Egypt |
| Abstract: | The development of a rapid method for measuring the thermal conductivity of adhesives is described. This was used for determining the effects of additions of copper and aluminium powders on the thermal conductivity of a toughened, single part epoxy adhesive. Results were obtained for various concentrations and grain sizes of both powder materials. |
| Keywords: | metal powder filled adhesive thermal conductivity determination aluminium copper |
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