An in situ TEM study of phase formation in gold-aluminum couples

In the gold wire bonding of aluminum in microelectronic devices the presence of aluminum oxide on the metallization surface may be expected. Electron transparent couples containing an oxide layer at the interface were heated in a TEM to determine the effects of a passivation layer on intermetallic formation. Intermetallic phases were evidenced by changes in sample appearance and their structure was determined by electron diffraction. The presence of an oxide at the interface hindered second phase formation at temperatures at which they were usually expected to form. In aluminum rich couples, the formation of the AuAl₂ intermetallic was not observed to form until about 350°C with the oxide present. In a reverse configuration involving a gold rich couple, an amorphous oxide phase was observed between the Al and the advancing Au₂Al front. The movement of the reaction front appeared to be controlled by surface diffusion across this phase.