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无氰镀银技术发展及研究现状
引用本文:张庆,成旦红,郭国才,郭长春,曹铁华.无氰镀银技术发展及研究现状[J].电镀与精饰,2007,29(5):12-16.
作者姓名:张庆  成旦红  郭国才  郭长春  曹铁华
作者单位:1. 上海大学,环境与化学工程学院,上海,200072
2. 中国浦东干部学院,上海,201204
3. 上海应用技术学院,上海,200235
摘    要:通过对硫代硫酸盐、丁二酰亚胺、碘化物、乙内酰脲、亚硫酸盐以及其它无氰镀银体系的分析,总结了当前无氰镀银工艺的技术特点及存在的问题,并阐述了无氰镀银技术的发展历程和研究现状。同时,基于国家目前的经济发展战略,对无氰镀银技术的前景予以了展望。

关 键 词:无氰镀银  发展  研究现状  环境保护
文章编号:1001-3849(2007)05-0012-05
收稿时间:2006-10-12
修稿时间:2006年10月12日

Development and Research Status Quo of Cyanide-free Silver Plating Technique
ZHANG Qing,CHENG Dan-hong,GUO Guo-cai,GUO Chang-chun,CAO Tie-hua.Development and Research Status Quo of Cyanide-free Silver Plating Technique[J].Plating & Finishing,2007,29(5):12-16.
Authors:ZHANG Qing  CHENG Dan-hong  GUO Guo-cai  GUO Chang-chun  CAO Tie-hua
Affiliation:1. Environment and Chemical Engineering College, Shanghai University, Shanghai 200072, China; 2. China Executive Leadership Academy Pudong, Shanghai 201204, China; 3. Shanghai Institute of Applied Technology, Shanghai 200235, China
Abstract:Technical characteristics and existing problems of cyanide-free silver plating technology were summarized through the analysis of cyanide-free silver plating systems of thiosulfate,succinimide,iodide,hydantoin,sulfite and others.Development course and research status quo of the cyanide-free silver plating technique were elaborated.In the meantime,the development future of the cyanide-free silver plating technique is prospected based on current economy development strategy of our country.
Keywords:cyanide-free silver plating  development  research status quo  environment protection
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