| 无氰镀银技术发展及研究现状 |
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| 引用本文： | 张庆,成旦红,郭国才,郭长春,曹铁华. 无氰镀银技术发展及研究现状[J]. 电镀与精饰, 2007, 29(5): 12-16 |
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| 作者姓名： | 张庆 成旦红 郭国才 郭长春 曹铁华 |
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| 作者单位： | 上海大学,环境与化学工程学院,上海,200072;中国浦东干部学院,上海,201204;上海应用技术学院,上海,200235 |
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| 摘 要： | 通过对硫代硫酸盐、丁二酰亚胺、碘化物、乙内酰脲、亚硫酸盐以及其它无氰镀银体系的分析,总结了当前无氰镀银工艺的技术特点及存在的问题,并阐述了无氰镀银技术的发展历程和研究现状。同时,基于国家目前的经济发展战略,对无氰镀银技术的前景予以了展望。
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| 关 键 词： | 无氰镀银 发展 研究现状 环境保护 |
| 文章编号： | 1001-3849（2007）05-0012-05 |
| 收稿时间： | 2006-10-12 |
| 修稿时间： | 2006-10-12 |
Development and Research Status Quo of Cyanide-free Silver Plating Technique |
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| ZHANG Qing,CHENG Dan-hong,GUO Guo-cai,GUO Chang-chun,CAO Tie-hua. Development and Research Status Quo of Cyanide-free Silver Plating Technique[J]. Plating & Finishing, 2007, 29(5): 12-16 |
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| Authors: | ZHANG Qing CHENG Dan-hong GUO Guo-cai GUO Chang-chun CAO Tie-hua |
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| Affiliation: | 1. Environment and Chemical Engineering College, Shanghai University, Shanghai 200072, China; 2. China Executive Leadership Academy Pudong, Shanghai 201204, China; 3. Shanghai Institute of Applied Technology, Shanghai 200235, China |
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| Abstract: | Technical characteristics and existing problems of cyanide-free silver plating technology were summarized through the analysis of cyanide-free silver plating systems of thiosulfate,succinimide,iodide,hydantoin,sulfite and others.Development course and research status quo of the cyanide-free silver plating technique were elaborated.In the meantime,the development future of the cyanide-free silver plating technique is prospected based on current economy development strategy of our country. |
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| Keywords: | cyanide-free silver plating development research status quo environment protection |
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