Electronic System Thermal Design for Reliability |
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Authors: | Hannemann R. |
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Affiliation: | Dept. of Mechanical Engineering; University of Mary-land; College Park, MD 20742 USA.; |
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Abstract: | Thermal design and analysis are important in Reliability/Availability/Maintainability R/A/M programs for electronic systems. A thermal design approach emphasizing the coupling of heat transfer theory and experiment to basic reliability considerations is illustrated here by discussing typical thermal problems on several system integration levels for a high reliability, multi-cabinet hybrid computer system. This paper emphasizes a particular attitude toward the thermal aspects of equipment design, one that is flexible in the methods of analysis, comprehensive in its treatment of each integration level in a complementary fashion, and oriented toward the goals of the R/A/M program as a whole. The examples show that conventional analytic solutions, when coupled with reliability theory and a modicum of experimental results, lead to effective thermal design. |
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