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Effect of high intensity magnetic field on intermetallic compounds growth in SnBi/Cu microelectronic interconnect |
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| Authors: | CZ Liu TY KangW Wei K ZhengL Fu L HuiJJ Wang WP Tong |
| Affiliation: | a Shenyang Aerospace University, Shenyang, 110136, China b Key Laboratory of Electromagnetic Processing of Materials, Ministry of Education, Northeastern University, Shenyang, 110819, China c State Key Laboratory for Manufacturing Systems Engineering Xi’an Jiaotong University, Xi’an, China |
| Abstract: | |
| Keywords: | Diffusion Kinetics Interconnect Magnetic field Intermetallic compounds |
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