CBGA器件温度场分布对焊点疲劳寿命影响的有限元分析

陶瓷封装器件的可靠性一直是电子封装领域关注的热点，目前有限元模拟方法在分析焊点疲劳寿命时大多采用了均一温度假设条件，而陶瓷封装器件由于自身材料性质，在热循环载荷下其内部温度场并不均匀.文中在传统经典理论的基础上利用ANSYS有限元软件采用六面体网格划分技术对16×16阵列的陶瓷球栅阵列（ceramic ball grid array，CBGA）封装模型在热循环载荷下的可靠性进行了仿真分析.考虑了热循环加载过程中CBGA器件内部的温度场分布，使用热力耦合模型讨论了均一温度假设在不同条件下的合理性.结果表明，考虑温度场分布的情况下预测的疲劳寿命要低于均一温度假设条件，为温度均一假设适用条件提供了判断依据.

Effect of temperature distribution of CBGA components on fatigue life of solder joint by FEA

The reliability of ceramic package devices have always been the attractive topic of electronic package. Many previous researches used a uniform temperature assumption to study the fatigue life of solder joint under thermal cycle through the finite element analysis method. But the internal temperature field of ceramic packing is not uniform in fact, because of its special nature of the material. In this paper, by using the ANSYS finite element software, the reliability of the 16×16 ceramic ball grid array (ceramic ball grid array, CBGA) package model under thermal cycle load was carried out based on the classical theory using hexahedral grid. Considering the internal temperature field distribution of the CBGA components under thermal cycle load, the rationality of the uniform temperature assumption under different conditions are discussed. And the simulation results show that the predict fatigue life under the condition of non-uniform temperature distribution is lower than the one with uniform temperature assumption conditions. Through the above discussion, the judgment can be provided for the usage of uniform temperature hypothesis.